SANTA CLARA, Calif., Nov., Jan. 14, 2022 (GLOBE NEWSWIRE) — PDF Solutions, Inc. (NASDAQ: PDFS ), a leading provider of unified data and cloud analytics for the semiconductor ecosystem, Montage announced today that it has selected PDF Solutions’ Exensio Fabless as its semiconductor analysis platform. Exensio Fabless was designed with a powerful and flexible analysis environment, which PDF Solutions considered a key factor in their decision.
Montage Technology is a leading IC design company dedicated to providing high-performance, low-power IC solutions for the cloud computing and data center markets. After a comprehensive evaluation, Montage chose PDF Solutions’ Exensio Fabless as the yield data analysis platform. The template function in Exensio Fabless supports independent customization, which not only meets Montage’s current needs, but also can flexibly expand and customize for future product analysis needs. In addition, Montage required local support for its manufacturing and test operations teams, which PDF Solutions was able to meet through its global support organization including local, face-to-face resources.
Shao Yi, Senior Product Manager of Montage Technology, said: “Our continued success depends on whether we can achieve excellent yield and product quality for end customers, and ensure that our products continue to exceed customer requirements. The advanced analysis capabilities of the Exensio analysis platform will Help Montage achieve efficient data analysis.”
“At PDF Solutions, we realize that each customer has unique needs and requirements that go beyond the capabilities of our products,” said Jun Jia, head of business development for PDF Solutions China. “Our vision is to provide our customers with a comprehensive data platform and advanced analytics that includes best-in-class products, professional services and local support. We are delighted that Montage has chosen Exensio Fabless and look forward to their continued success in the market success.”
About Exensio Fabless
Exensio Fabless is PDF Solutions’ fully integrated end-to-end analytics solution for fabless semiconductor companies, designed to help engineers and data scientists in the semiconductor ecosystem rapidly improve the yield, quality and profitability of their devices. Combined with PDF Solutions’ professional services, the Exensio Fabless platform is designed to enable its customers to realize the benefits of Industry 4.0 by transforming the way ecosystems collect, analyze and share data.
About PDF Solutions
PDF Solutions (NASDAQ: PDFS) provides a comprehensive cloud analytics platform designed to help engineers and organizations across the semiconductor ecosystem improve the yield and quality of their products and improve operational efficiency to improve profitability. The company’s products and services are used by Fortune 500 companies in the semiconductor ecosystem to impact business outcomes and drive profitability, enabling smart manufacturing by connecting and controlling devices, collecting data during manufacturing and test operations, and performing advanced analytics and machine learning The goal – mass production.
Founded in 1991, PDF Solutions is headquartered in Santa Clara, California, with operations in North America, Europe and Asia. The Company (directly or through one or more subsidiaries) is an active member of SEMI, INEMI, TPCA, IPC, OPC Foundation and DMDII. For the latest news and information on PDF Solutions, visit https://www.pdf.com/.
PDF Solutions, the PDF Solutions logo and Exensio are trademarks or registered trademarks of PDF Solutions, Inc. or its subsidiaries. All other trademarks referenced in this press release are the property of their respective owners.
contact person
Sonia Segovia
Investor Relations
Phone: (408) 938-6491
Email: sonia.segovia@pdf.com
Jia Jun
Head of China Business Development
Phone: (408) 841-4311
E-mail: jun.jia@pdf.com
